#StayHappening
Tue Nov 03 2026 at 12:00 pm to 05:00 pm UTC+00:00

Industrial Liaison Forum 2026 - School of Engineering & Materials Science

  • Queen Mary University of London · London
  • From GBP 0.00
Professor James Busfield Publisher / Host Professor James Busfield
Share
Industrial Liaison Forum 2026 - School of Engineering & Materials Science
Advertisement
This event will bring together students, alumni, employers and industry collaborators of the School of Engineering & Materials Science, QMUL
About this Event

Welcome to the Industrial Liaison Forum 2026 hosted by the School of Engineering & Materials Science! Join us on Tuesday 3rd November 2026 for a day filled with insightful discussions, networking opportunities, and collaboration. This in-person event is a great opportunity for industry professionals, researchers, and students to come together and exchange ideas. Don't miss out on this chance to connect with leaders in the field and stay up-to-date on the latest trends and innovations. We look forward to seeing you there!



Agenda

🕑: 12:00 PM - 12:30 PM
Networking Lunch

Info: Lunch will be provided for all visitors.


🕑: 12:30 PM - 02:30 PM
Industrial Advisory Board Meeting

Info: This is for Industrial Advisory Board members. However, we welcome new members. Please contact [email protected] if you would like to join the IAB.


🕑: 02:30 PM - 04:30 PM
Research Showcase

Info: Showcasing the work of our post-docs and PhD students with posters and presentations. It's a great way to discover more about the breadth of our research activities and build collaborations.


🕑: 04:30 PM - 05:00 PM
Student prize-giving
Advertisement

Event venue & nearby stays

Queen Mary University of London, 327 Mile End Road, London, United Kingdom

Tickets GBP 0.00
Concerts, fests, parties, meetups — all the happenings, one place.

Discover more events by tag

Ask AI if this event suits you

Keep the plans coming

More events in London

London is happening.

See everything else that’s on — concerts, markets, comedy and more.