CASPA 35th Annual Conference & Dinner Banquet — The CEO Summit

CASPA 35th Annual Conference & Dinner Banquet

“Behind every technological revolution are the leaders bold enough to shape it. The CEO Summit was created to unite those leaders under one stage.”
— Jimmy Cheng, Creator of the CEO Summit, CASPA President 2026–2027

The CEO Summit at CASPA’s 35th Annual Conference and Dinner Banquet represents the pinnacle of semiconductor leadership — an exclusive gathering designed to foster dialogue among the industry’s most influential figures. For the first time in CASPA history, an extraordinary lineup of world-renowned CEOs, founders, technology pioneers, Nobel Laureates, and venture capital leaders come together to share their vision for AI, semiconductors, and advanced computing.

Under this year’s theme, “Silicon, Systems, and Intelligence: Designing the Next Decade,” the summit explores how the decisions made today will define the next era of technology — from advanced silicon to AI-driven systems.

📅 October 23–24, 2026 • 📍 Santa Clara Convention Center

An exclusive on-stage Fireside Chat between Lip-Bu Tan, CEO of Intel, and Jimmy Cheng, President of CASPA (2026–2027) — offering rare insights into leadership, innovation, and the future of the semiconductor industry.

More distinguished speakers to be announced soon.

• 1:30 – 1:40 PM — CASPA Opening
• 1:40 – 2:00 PM — Credo Address
  Bill Brennan (CEO, Credo)
• 2:00 – 2:40 PM — Semiconductor Industry Outlook Panel
  Stacy Rasgon (Managing Director, Bernstein), Dylan Patel (CEO, SemiAnalysis) • Moderator: Austin Lyons (Senior Analyst, Creative Strategies)
• 2:40 – 3:30 PM — Silicon Capital: Investing in the Next Semiconductor Wave
  Shahin Farshchi (General Partner, Lux Capital), Albert Kim (Head, Samsung Ventures America), Andrew Tan (Managing Director, Salience Capital), Umesh Padval (Managing Partner, Seligman Ventures) • Moderator: Brandon Wang (VP, Synopsys)
• 3:30 – 4:20 PM — AI Computing: Designing the Next Generation of Intelligence
  Faraj Aalaei (CEO, Cognichip), Sunghyun Park (CEO, Rebellions), Barun Kar (CEO, Upscale AI) • Moderator: Daniel Nenni (Founder, SemiWiki)
• 4:20 – 5:10 PM — Edge AI & Intelligent Infrastructure
  Krishna Rangasayee (CEO, Sima.ai), Melton Chang (President, Schneider Electric Power Systems), Sid Sheth (CEO, D-Matrix) • Moderator: Dylan Patel (CEO, SemiAnalysis)
• Conference Close
• 6:00 – 7:00 PM — BOD Election

• 9:00 – 9:10 AM — CASPA Welcome Remarks
• 9:10 – 9:30 AM — SEMI Industry Update
  Ajit Manocha (CEO, SEMI)
• 9:30 – 9:50 AM — IEEE Address
  Mary Ellen Randall (President & CEO, IEEE)
• 9:50 – 9:55 AM — GSA Address (Video)
  Jodi Shelton (CEO, Global Semiconductor Alliance)
• 9:55 – 10:15 AM — Re-Engineering the Future
  Sassine Ghazi (CEO, Synopsys)
• 10:15 – 10:30 AM — Break
• 10:30 – 11:10 AM — Data Storage & Infrastructure in the AI Era
  Xin Guo (CEO, Solidigm), Khurram Ismail (CPO, SanDisk), Hao Zhong (CEO, Scaleflux) • Moderator: Nan Zhou (Director, Temasek)
• 11:10 – 11:50 AM — AI Compute: Architectures Beyond the GPU
  Naveen Rao (CEO, Unconventional AI), Faris Sbahi (CEO, Normal Computing), Rodrigo Liang (CEO, SambaNova) • Moderator: Ian Cutress (CEO, More than Moore)
• 11:50 AM – 1:00 PM — Networking Lunch

• 1:00 – 1:20 PM — The Race to Connect AI
  Michael Hurlston (CEO, Lumentum)
• 1:20 – 1:40 PM — ASIC Design and Cyber Security
  Michael Xie (President & Co-Founder, Fortinet)
• 1:40 – 2:00 PM — WD Address
  Irving Tan (CEO, WD)
• 2:00 – 2:30 PM — The Next Semiconductor Era: FPGAs, Advanced Manufacturing & Physical AI
  Raghib Hussain (CEO, Altera), David Lam (CEO, Multibeam; Founder, Lam Research) • Moderator: Nitin Dahad (Executive Editor, EE Times)
• 2:30 – 2:40 PM — Break
• 2:40 – 3:20 PM — From AI Algorithms to AI Silicon: Redefining the Future of Compute
  Anna Goldie (CEO, Ricursive Intelligence), Gavin Uberti (CEO, Etched), Ankur Gupta (Head of EDA IC, Siemens) • Moderator: Edward Sperling (Editor in Chief, Semiconductor Engineering)
• 3:20 – 4:00 PM — Optical Interconnects & High-Speed Connectivity: The Next Data Center
  Albert Zhang (CEO, Silith), Mark Wade (CEO, Ayar Labs), Hong Hou (CEO, Semtech) • Moderator: Dan Armbrust (Co-founder, Silicon Catalyst)
• 4:00 – 4:30 PM — Wafer-Scale AI: Breaking the Compute Bottleneck
  Andrew Feldman (CEO, Cerebras) in conversation with Jimmy Cheng (President, CASPA ’26–27)
• 4:30 – 5:00 PM — Dinner Banquet Registration

• 5:00 – 6:00 PM — VIP Reception
• 6:20 – 6:30 PM — Welcome Speech
• 6:30 – 7:00 PM — Dinner
• 7:00 – 7:15 PM — CASPA 2025–2026 President Gary Wang’s Speech
• 7:15 – 7:25 PM — CASPA Leadership Transition Ceremony
• 7:25 – 7:40 PM — CASPA 2026–2027 President Jimmy Cheng’s Speech
• 7:40 – 7:45 PM — Special Address and Introduction of Lip-Bu Tan
  Dr. Chenming Hu (TSMC Distinguished Professor Emeritus, Father of the 3D Transistor, UC Berkeley)
• 7:45 – 8:45 PM — Fireside Chat: Intel CEO Lip-Bu Tan and CASPA President Jimmy Cheng
• 8:45 – 9:05 PM — Introduction of Annual Conference Speakers on Stage
• 9:05 – 9:20 PM — CASPA/IEEE Scholarship (issued by IEEE President and Intel CEO)
• 9:20 – 9:35 PM — Raffle
• 9:35 – 10:05 PM — Networking

Santa Clara Convention Center
5001 Great America Pkwy, Santa Clara, CA 95054

Attendance is strictly limited to ensure an intimate atmosphere for meaningful dialogue among industry leaders. Join us for what promises to be the most significant CEO Summit in CASPA’s 35-year history.

caspaceosummit.com
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All speakers, session topics, schedules, and event activities are subject to change. While every effort will be made to present the advertised program, unforeseen business or personal commitments may require speaker substitutions or schedule modifications. CASPA reserves the right to make changes without prior notice.

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Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, United States

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