About this Event
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Talk Synopsis:
Reliability studies of systems including power electronics and advanced deep submicron electronic systems have demonstrated that multiple failure mechanisms occur during normal operation. The most advanced devices exhibit failure after only a few years of operation, exhibiting a random end-of-life behavior that can occur far more frequently than published expectations. Our research is dedicated to understanding reliability physics and performing advanced life testing of multiple, competing mechanisms and their interactions that limit the useful life and results in failures of commercial and military electronic systems. We strive to develop application specific reliability qualifications used in design for reliability and to develop a commercial tool for designers to incorporate reliability together with performance as part of the system qualification.
The standard industrial approach to accelerated testing continues to assume a single failure mechanism as canonized in the Mil Handbook 217 approach. In an ideal case, where only one thermal mechanism overwhelms other competing mechanisms, this methodology may be well founded. However today, in our push to faster and more complex system designs, we have found that this methodology falls far short of expectations for reliability qualification. Hence, a modern assessment must be more sophisticated and consider all the root cause mechanisms of failure simultaneously.
In this Tutorial, I will teach a practical linear approach to lifetime and reliability prediction through modeling failure mechanisms as proven by accelerated testing of commercial parts. We analyze failures of the components and compare the mechanisms that we model in the laboratory to be sure that our models accurately reflect the true physics of failure responsible for unreliability to better control their effects. We isolate the mechanisms using specific accelerated tests and incorporate these models into a system reliability matrix. We perform a trade-off analysis as part of the design parameters where we can tailor the reliability of a system to meet the performance and reliability specifications before the system is built and in the field. The result is a more accurate and correct reliability assessment compared to the current approach for building in reliability.
Speaker:Joseph B. Bernstein, Professor of Electrical Engineering at Ariel University
Professor Joseph B. Bernstein, has expertise in several areas of micro-electronic device reliability and physics of failure research including packaging, system reliability modeling, gate oxide integrity, radiation effects, Flash NAND and NOR memory, SRAM and DRAM, MEMS and laser programmable metal interconnect. He directs the Laboratory for Failure Analysis and Reliability of Electronic Systems, teaches VLSI design courses, and heads the VLSI program at Ariel University. His Laboratory is a center of research activity dedicated to serving the needs of manufacturers of highly reliable electronic systems using commercial off the shelf parts.
Research areas include thermal, mechanical, and electrical interactions of failure mechanisms of ultra-thin gate dielectrics, Non-Volatile memory, advanced metallization, and power devices. He also works extensively with the semiconductor industry on projects relating to failure analysis, defect avoidance, programmable interconnect used in Field Programmable Arrays and repair in microelectronic circuits and packaging. He has developed a method for predicting device failure rates based on new JEDEC standards for multiple failure rate-based prediction. Professor Bernstein was a Fulbright Senior Researcher/Lecturer at Tel Aviv University in the Department of Electrical Engineering, Physical Electronics. Professor Bernstein is a senior member of IEEE.
Professor Bernstein is a co-author of his latest book on Reliability Prediction for Microelectronics, in which he develops the material that will be taught in this Tutorial. The book is available from Wiley and can be purchased through Amazon or any on-line book purchasing website.
Event Venue
Online
USD 0.00
