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The 8th Semiconductor Design, Construction & Engineering Summit brings together semiconductor manufacturers, fabowners, EPC contractors, engineers, technology providers and industry leaders to address the challenges and opportunities
shaping the next generation of U.S. chip manufacturing.
As domestic manufacturing capacity continues to expand, the industry faces increasing pressure to deliver advanced
facilities faster, strengthen supply chains, secure skilled talent, and build resilient infrastructure for increasingly sophisticated
production environments. From advanced packaging and High-NA EUV readiness to mega-fab project execution, utility
infrastructure, water management and cleanroom engineering, organisations are rethinking how semiconductor facilities
are designed, constructed and commissioned.
Arizona sits at the centre of this expansion, with more than $314 billion in semiconductor investment announced since 2020.
With TSMC's latest $100 billion investment bringing its planned Arizona commitment to approximately $265 billion, the state
is becoming an increasingly critical hub for U.S. semiconductor manufacturing and facility development.
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Event venue
414 N 5th St, Phoenix, AZ 85004-2167, United States
Tickets
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