Advertisement
Olin 202/204ABSTRACT: The history of modern computing has been shaped as much by advances in thermal management as by
improvements in semiconductor design. From the early days of the IBM PC, where processors dissipated only a few
watts and required no active cooling, to today’s graphics processing units (GPUs) exceeding 1,000 W per chip, the
demand for efficient electronics cooling has steadily grown in both urgency and complexity. This presentation
provides a historical perspective on the evolution of thermal solutions for central processing units (CPUs) and GPUs,
including the adoption of pin-fin heat sinks, forced convection, thermoelectric coolers, heat pipes, and vapor
chambers. It further explores the growing challenges introduced by laptop and server designs, as well as the
hierarchical nature of electronics packaging The presentation outlines emerging opportunities in electronics cooling
across diverse domains, including AI data centers, telecommunications, automotive power electronics, electricvehicle battery systems, LEDs, and renewable energy. This talk emphasizes the central role of cooling innovations in
enabling continued progress in high-performance computing and sustainable electronics.
Advertisement
Event Venue & Nearby Stays
Marquette University, Milwaukee, United States
