Adhesion and Bonding Expo

Wed, 13 May, 2026 at 10:00 am to Fri, 15 May, 2026 at 05:00 pm UTC+09:00

INTEX Osaka | Osaka

RX
Publisher/HostRX
Adhesion and Bonding Expo
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A specialised exhibition featuring joining technologies, from welding to ultrasonic bonding, including solutions for dissimilar material com


About this Event


A specialised exhibition featuring joining technologies, from welding to ultrasonic bonding, including solutions for dissimilar material combinations.


Adhesion & Bonding Expo is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion, and more. It also attracts attentions for dissimilar material joining technologies.


Held twice a year in Osaka and Tokyo within HIghly-Functional Material Week, attendees can explore a wide variety of adhesive agent, test out industrial equipment, and learn from industry experts throughout the technical conference sessions.​



WHO CAN VISIT?:

- R&D Engineer / Research Engineer

- Materials Engineer / Materials Scientist

- Manufacturing Engineer / Process Engineer

- Production Manager / Operations Manager

- Quality Assurance (QA) / Quality Control (QC) Manager

- Product Development Engineer

- Design Engineer / Mechanical Engineer

- Automation / Robotics Engineer

- Plant Manager / Factory Manager

- Procurement Manager / Purchasing Manager

- Supply Chain Manager

- Technical Manager / Engineering Manager

- New Business Development Manager

- Technology Strategy / Innovation Manager

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Event Venue

INTEX Osaka, 102, Osaka, Japan

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