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Intex is thrilled to be attending the 𝗕𝗢𝗜𝗡𝗭 𝟱𝟳𝘁𝗵 𝗔𝗻𝗻𝘂𝗮𝗹 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗮𝗻𝗱 𝗘𝘅𝗽𝗼 in Wellington, New Zealand from May 20. It is an incredible opportunity to connect with industry leaders and to showcase our innovative, game-changing 𝗤𝘂𝗯𝗶𝘁𝟯𝟲𝟬™ - “Solving Movement in TALL Buildings”. The theme of this year’s BOINZ event is “Building resilience”, resonating with Intex’ absolute goal of achieving with its Qubit360™ Total Frame Isolation methodology.
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Event Venue & Nearby Stays
TSB Bank Arena, Queen's Wharf, Wellington,Wellington, New Zealand
